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Single-wafer plasma etching processing equipment (single-wafer plasma etcher)

Single-wafer plasma etching processing device (single-wafer plasma etcher)

This device is a single-wafer plasma etching processing apparatus that performs treatments such as etching of polyimide-based resins and nitride films, as well as ashing (ash removal) of photoresists, using parallel plate high-frequency plasma. The operation panel allows switching between DP mode and RIE mode. It supports wafer sizes of 6 inches and 8 inches.